| Network | Technology: GSM / HSPA / LTE 2G bands: GSM 850 / 900 / 1800 / 1900 – SIM 1 & SIM 2 3G bands: HSDPA 850 / 900 / 2100 4G bands: 1, 3, 5, 8, 38, 40, 41 Speed: HSPA 42.2/5.76 Mbps, LTE-A |
| Launch | Announced: 2021, March 24 Status: Available. Released 2021, March 25 |
| Body | Dimensions: 160.6 x 73.9 x 8 mm (6.32 x 2.91 x 0.31 in) Weight: 177 g (6.24 oz) Build: Glass front, plastic frame, plastic back SIM: Dual SIM (Nano-SIM, dual stand-by) |
| Display | Type: Super AMOLED, HDR10, 1000 nits (peak) Size: 6.4 inches, 98.9 cm2 (~83.3% screen-to-body ratio) Resolution: 1080 x 2400 pixels, 20:9 ratio (~411 ppi density) Always-on display |
| Platform | OS: Android 11, Realme UI 2.0 Chipset: Mediatek Helio G95 (12 nm) CPU: Octa-core (2×2.05 GHz Cortex-A76 & 6×2.0 GHz Cortex-A55) GPU: Mali-G76 MC4 |
| Memory | Card slot: microSDXC (dedicated slot) Internal: 64GB 4GB RAM, 128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM UFS 2.1 |
| Main Camera | Quad: 64 MP, f/1.8, 26mm (wide), 1/1.73″, 0.8µm, PDAF 8 MP, f/2.3, 119˚, 16mm (ultrawide), 1/4.0″, 1.12µm 2 MP, f/2.4, (macro) 2 MP, f/2.4, (depth) Features: LED flash, HDR, panorama Video: 4K@30fps, 1080p@30/60/120fps, gyro-EIS |
| Selfie camera | Single: 16 MP, f/2.5, (wide), 1/3.0″, 1.0µm Features: HDR, panorama Video: 1080p@30/120fps, gyro-EIS |
| Sound | Loudspeaker: Yes 3.5mm jack: Yes 24-bit/192kHz audio |
| Comms | WLAN: Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot Bluetooth: 5.1, A2DP, LE GPS: Yes, with A-GPS, GLONASS, BDS NFC: Yes (market/region dependent) Radio: No USB: USB Type-C 2.0, USB On-The-Go |
| Features | Sensors: Fingerprint (under display, optical), accelerometer, gyro, proximity, compass |
| Battery | Type: Li-Po 5000 mAh, non-removable Charging: Fast charging 30W, 50% in 26 min, 100% in 65 min (advertised) |
| Misc | Colors: Cyber Silver, Cyber Black Models: RMX3085 |
Realme 8 Full Specifications and price. Super AMOLED, HDR10, 1000 nits (peak). 64GB 4GB RAM, 128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM.
At HAMKO Future Tech Academy We are dedicated to shaping the future of technology by equipping students with the skills and knowledge needed to excel in the dynamic world of industrial attachment and freelancing programs
